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Communication Dans Un Congrès Année : 2017

Composite selection for electronic packaging: case study and software development


Electronic packaging in aeronautics are for the moment made in aluminium parts with pins. The set of requirements of such components require of course to extract heat from electronic device but also some electronic shielding as well as good behavior to vibrations. A general materials selection analysis using classical tools as CES indicate that composite materials could be good candidates to reduce weight of these components. The real set of requirements are given in terms of maximum temperature of the packaging and thus require a more detail analysis related to the shape of the component and composite architecture and material selection. Such an analysis is difficult to perform using CES for the moment so to answer to this problem a specific methodology was employed: • Numerical simulation using COMSOL have been performed to obtained meta-model giving the maximum temperature of the packaging as a function of electronic power, heat exchange coefficient, thickness of packaging and composite thermal conductivities in the 3 directions. • A specific tool written with MATLAB has been developed in order to be able to import these meta models and to perform easily a composite selection that allow to select the matrix, the volume fraction, the reinforcement as well as geometrical characteristic of the component. The methodology and the tool developed could be used in many kind of applications and are complementary to CES software. Furthermore this tool can be easily extent to other architectural structures such as sandwiches, foams, multilayer...
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Dates et versions

hal-02465686 , version 1 (04-02-2020)


  • HAL Id : hal-02465686 , version 1


Tiana Deplancke, T. Bormann, Luc Salvo, Yves Bréchet. Composite selection for electronic packaging: case study and software development. 9th International Materials Education Symposium, Apr 2017, Cambridge, United Kingdom. ⟨hal-02465686⟩
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