Impact of Thermal Stress on Device Physics and Morphology in Organic Photodetectors - Université de Lille Accéder directement au contenu
Article Dans Une Revue ACS Energy Letters Année : 2023

Impact of Thermal Stress on Device Physics and Morphology in Organic Photodetectors

Hoang Mai Luong
  • Fonction : Auteur
Sangmin Chae
  • Fonction : Auteur
Ahra Yi
  • Fonction : Auteur
Kan Ding
  • Fonction : Auteur
Jianfei Huang
  • Fonction : Auteur
Brian Minki Kim
  • Fonction : Auteur
Jingcong Chen
  • Fonction : Auteur
Hiba Wakidi
  • Fonction : Auteur
Zhifang Du
  • Fonction : Auteur
Hyo Jung Kim
  • Fonction : Auteur
Harald Ade
  • Fonction : Auteur
Thuc-Quyen Nguyen
  • Fonction : Auteur

Résumé

Organic photodetectors (OPDs) capable of detecting visible to near-infrared light provide a ubiquitous platform for emerging flexible and wearable electronics. In the process of implementing OPDs into a Si-based manufacturing process, organic semiconductors undergo ≥ 200 °C thermal stress, leading to the deterioration of photosensing capability. Here, we combine multiscale characterization and device physics to unravel the impact of thermal stress on the optoelectronics characteristics of PTB7-Th:non-fullerene acceptor blends (NFAs: SiOTIC-4F, COTIC-4F, CO1-4F, and CO1-4Cl). For as-cast devices, favorable intermixing and phase separation between PTB7-Th and the NFA facilitate charge generation and extraction. Reductions in the OPD performance after thermal annealing (200 °C for 5–120 min) are observed due to the morphological degradation, regardless of the NFA choice, but the reduction is more severe for the PTB7-Th:SiOTIC-4F blend. Thermally induced morphological changes are examined using atomic force microscopy, wide-angle X-ray scattering, and solid-state NMR spectroscopy. This study provides essential insights into morphology-driven deteriorations, which will help in developing structure–stability–performance relationships in high detectivity OPDs.
Fichier non déposé

Dates et versions

hal-04531030 , version 1 (03-04-2024)

Identifiants

Citer

Hoang Mai Luong, Sangmin Chae, Ahra Yi, Kan Ding, Jianfei Huang, et al.. Impact of Thermal Stress on Device Physics and Morphology in Organic Photodetectors. ACS Energy Letters, 2023, ACS Energy Letters, 8 (5), pp.2130-2140. ⟨10.1021/acsenergylett.3c00272⟩. ⟨hal-04531030⟩
0 Consultations
0 Téléchargements

Altmetric

Partager

Gmail Facebook X LinkedIn More