Strong metal–support interaction (SMSI) is a pivotal strategy in thermal catalysis; however, its application in photocatalysis leaves ample area for further development. A method inducing SMSI between earth-abundant metals, such as copper and TiO2, at room temperature, and thus hindering the agglomeration of copper species remains rarely reported. In this work, we achieved SMSI construction of TiO2 overlayers on Cu nanoparticles via a straightforward soft-chemistry method. SMSI coverage is stable even after high-temperature treatment in the air (500 °C), as demonstrated by chemical mapping and surface analysis. The method is more accurate than thermal reduction since it produces a metastable, highly active anatase phase. Interestingly, the TiO2 overlayer induces the formation of four-coordinated copper(II) species surrounded by oxygen atoms, resulting in coexisting CuO2 planes, which were monitored through high-resolution transmission electron microscopy and electron paramagnetic resonance spectroscopy. The stronger interfacial interaction by forming Ti–O–Cu bonding promotes charge carrier separation, producing twice as much H2 than the low interfacial interaction within a conventional photoactive system wherein copper was decorated onto TiO2. Our approach offers a rational design for SMSI materials in photocatalysis, which is extendable to other catalytic reactions.